CELL FOR MEASURING CONCENTRATION OF ADDITIVE BREAKDOWN PRODUCTION IN PLATING SOLUTION
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United States of America Patent
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Issued Date -
Dec 8, 2022
app pub date -
Sep 25, 2020
filing date -
Sep 25, 2020
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Abstract
Provided are a measurement method, an electrochemical measuring cell, and a measuring device which are capable of directly and continuously measuring the concentration of monovalent copper ions (Cu+), 3-mercaptopropyl sulfonate (MPS), or Cu+-MPS, which is a plating additive breakdown product, in a plating solution during a copper plating process.
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