THERMALLY-CONDUCTIVE CURABLE COMPOSITION
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United States of America Patent
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Issued Date -
Dec 8, 2022
app pub date -
Nov 4, 2020
filing date -
Nov 4, 2020
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Abstract
The present disclosure relates to a curable composition comprising: a) a base component comprising a cationically self-curable silicone-based oligomeric compound; b) a curing system for the cationically self-curable silicone-based oligomeric compound; and c) a thermally-conductive filler. According to another aspect, the present disclosure is directed to method of manufacturing a curable composition. In yet another aspect, the disclosure relates to the use of a thermally-conductive curable composition for industrial applications, in particular for thermal management applications in the automotive industry.
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