METHOD OF CUTTING COMBINED STRUCTURE OF GLASS SUBSTRATE AND LIGHT-ABSORBING PLATE
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United States of America Patent
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Issued Date -
Dec 8, 2022
app pub date -
Nov 19, 2020
filing date -
Nov 19, 2020
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Abstract
A method of cutting a combined structure of a glass substrate and a light absorbing plate includes providing a glass substrate on a metal plate, providing a light absorbing material at an edge of the glass substrate, and cutting the glass substrate and the light absorbing plate by irradiating a laser beam to the glass substrate from the edge to which the light absorbing material is provided.
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