Method of controlling properties of nanoparticles and patterning with nanoparticles by ink lithography
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United States of America Patent
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Jul 18, 2023
Grant Date -
Dec 8, 2022
app pub date -
Mar 31, 2022
filing date -
Jun 7, 2021
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Abstract
Disclosed is a patterning method by ink lithography. More particularly, the patterning method includes coating thin film-forming nanoparticles surrounded by the first ligand on a substrate to form a nanoparticle thin film; directly spraying a ligand-substituting ink to a selected region on the nanoparticle thin film to form a region in which the first ligand is substituted with the second ligand; and washing the nanoparticle thin film with a washing solvent so that the region substituted with the second ligand is patterned.
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