SCALP CUPPING DEVICE, ELECTRONIC CUPPING DEVICE SYSTEM HAVING SAME, AND USE METHOD THEREFOR
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United States of America Patent
Stats
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N/A
Issued Date -
Dec 8, 2022
app pub date -
Oct 1, 2019
filing date -
Oct 1, 2019
priority date (Note) -
Published
status (Latency Note)
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Importance

US Family Size
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Non-US Coverage
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Abstract
The present invention relates to a scalp cupping device, an electronic cupping device system having same, and a use method therefor. The scalp cupping device, according to the present invention, for discharging body waste by using a negative-pressure load obtaining suction force from the removal of the inner air thereof can comprise: a negative pressure-controlling main cup having a negative pressure adjustment means provided at the upper side thereof so as to apply a negative-pressure load to the inside thereof; and a body contact auxiliary cup which is inserted into and coupled to the opened lower portion of the main cup, and which has, on the circumference of the bottom opening thereof, a contact portion for coming in contact with the body.
First Claim
all claims..Other Claims data not available
Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
---|---|---|---|---|---|
KR | B1 | KR102413847 | Sep 10, 2019 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
PATENT SPECIFICATION | 두피전용 부항기, 이를 구비한 전자 부항기 시스템, 및 그 사용방법 | Jun 28, 2022 | |||
WO | A1 | WO2021049701 | Oct 01, 2019 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
INTERNATIONAL APPLICATION PUBLISHED WITH INTERNATIONAL SEARCH REPORT | 두피전용 부항기, 이를 구비한 전자 부항기 시스템, 및 그 사용방법 | Mar 18, 2021 |
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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PARK HYUN JA | #103-203 50 SICHEONG-RO GWANGMYEONG-SI GYEONGGI-DO 14233 |
International Classification(s)

- 2019 Application Filing Year
- A61M Class
- 7452 Applications Filed
- 4617 Patents Issued To-Date
- 61.96 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
PARK, Sang Jun | Gunpo-si, KR | 171 | 1174 |
# of filed Patents : 171 Total Citations : 1174 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 2 Citation Count
- A61M Class
- 69.89 % this patent is cited more than
- 3 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Jun 8, 2026 |
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jun 8, 2030 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jun 8, 2034 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 3.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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