Printed Micro and Nanostructured Arrays for Thermal Management of Electronic Devices
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United States of America Patent
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Issued Date -
Dec 1, 2022
app pub date -
May 31, 2022
filing date -
May 31, 2022
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Abstract
Systems and methods for cooling integrated circuits and other chop-based electronic devices use plasmonic absorption and emission of near infrared (NIR) radiation. Nanostructure arrays tuned to appropriate infrared wavelengths emit NIR from a hot chip substrate to other nanostructure arrays at the chip outer package, which absorb the NIR and transmit it away from the package outer surface.
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