SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Nov 24, 2022
app pub date -
Apr 18, 2022
filing date -
Apr 18, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device, including a sealing body portion, a nut and a bus bar. The sealing body portion has a housing portion formed on a front surface thereof, the sealing body portion including a semiconductor chip contained therein and a plurality of pin-shaped external connection terminals electrically connected to the semiconductor chip. The nut has a screw hole and disposed in the housing portion. The bus bar is arranged opposite the housing portion, and includes a fastening area with an opening portion opposite the screw hole of the nut, and a bonding area that is outside the fastening area and is connected to the plurality of external connection terminals. The sealing body portion has a protrusion adjacent to the bonding area of the bus bar.
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