METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS
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United States of America Patent
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Issued Date -
Nov 24, 2022
app pub date -
May 18, 2022
filing date -
May 18, 2022
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Abstract
Methods and related systems for topographically depositing a material on a substrate are disclosed. The substrate comprises a proximal surface and a gap feature. The gap feature comprises a sidewall and a distal surface. Exemplary methods comprise, in the given order: a step of positioning the substrate on a substrate support in a reaction chamber; a step of subjecting the substrate to a plasma pre-treatment; and, a step of selectively depositing a material on at least one of the proximal surface and the distal surface with respect to the sidewall. The step of subjecting the substrate to a plasma pre-treatment comprises exposing the substrate to at least one of fluorine-containing molecules, ions, and radicals.
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