THREE-DIMENSIONALLY PATTERNABLE THERMAL INTERFACE
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United States of America Patent
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Nov 17, 2022
app pub date -
Apr 25, 2022
filing date -
Oct 25, 2019
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Abstract
A three-dimensional geometry of a thermal interface body may be customized to substantially fill an irregular gap along a thermal dissipation pathway in an electronic package. The thermal interface body is fabricated through an additive deposition process, wherein sequential patterns of thermal interface material are coherently connected to other deposited patterns of thermal interface material.
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