METHOD AND APPARATUS FOR IMPROVED WAFER COATING
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United States of America Patent
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Issued Date -
Nov 17, 2022
app pub date -
Jan 12, 2022
filing date -
May 14, 2021
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Abstract
A semiconductor device comprises a metallization layer, a passivation layer disposed above the metallization layer, a copper redistribution layer disposed on the passivation layer, a second passivation layer disposed on the copper redistribution layer, and a polyimide layer disposed over the second passivation layer. The polyimide layer and the second passivation layer include a continuous gap there-through that exposes a portion of the copper redistribution layer.
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