SUBSTRATE PROCESSING METHOD
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United States of America Patent
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Issued Date -
Nov 17, 2022
app pub date -
Oct 15, 2020
filing date -
Oct 30, 2019
priority date (Note) -
Published
status (Latency Note)
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Abstract
The substrate has a plurality of chip regions each being provided with a structure to be a power device, and is provided with a to-be-processed film. The thickness profile of the to-be-processed film in the radial direction is measured by scanning with the sensor in the radial direction while the substrate is rotated. The average thickness of the thickness profile is calculated. At least one radial position where the thickness profile has an average thickness is extracted as at least one candidate position. At least one of the at least one candidate position is determined to be at least one measurement position. Processing liquid is supplied from a nozzle onto the to-be-processed film of the substrate while the substrate is rotated. The sensor monitors the time-dependent change in the thickness of the to-be-processed film in at least one measurement position while the substrate is rotated.
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Family
| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| JP | B2 | JP7376317 | Oct 30, 2019 |
| CN | B | CN114616649 | Oct 15, 2020 |
| WO | A1 | WO2021085160 | Oct 15, 2020 |
| TW | B | TWI738548 | Oct 26, 2020 |
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