THERMOSETTING COMPOSITION, METHOD OF MANUFACTURING MOLDED ARTICLE USING THE SAME, AND CURED PRODUCT

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United States of America Patent

APP PUB NO 20220363881A1
SERIAL NO

17763140

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Abstract

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A thermosetting composition comprising the following component (A) and component (B), and having a viscosity of 0.1 Pa·s or higher and 100 Pa·s or lower at a shear rate of 10 s−1 at 25° C. measured in accordance with JIS K7117-2.

    (A) polybutadiene having a structural unit represented by the following formula (1A) and a structural unit represented by the following formula (1B), wherein the terminal group comprises a methacryloyl group or an acryloyl group(B) a thermal polymerization initiator

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Patent Owner(s)

Patent OwnerAddress
IDEMITSU KOSAN CO LTDJAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
OBATA, Yutaka Ichihara-shi, JP 29 132
OKADA, Yasunari Ichihara-shi, JP 19 74
TAKEBE, Tomoaki Ichihara-shi, JP 44 228

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