PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
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United States of America Patent
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Nov 10, 2022
app pub date -
Jan 30, 2020
filing date -
Jan 30, 2020
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Abstract
One plasma processing apparatus according to the invention includes: a processing chamber in which a sample is subjected to plasma processing; a first radio frequency power supply configured to supply a first radio frequency power for generating plasma via a matching unit; a sample stage on which the sample is placed; a second radio frequency power supply configured to supply a second radio frequency power to the sample stage; and a control device configured to control a matching unit so as to perform matching during a period corresponding to a mode in which a requirement for matching by the matching unit is defined when the first radio frequency power is modulated by a waveform having a plurality of amplitude values and repeating periodically. The period is each period of the waveform corresponding to any one of the plurality of amplitude values.
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