HIGHLY-INTEGRATED COMPACT DIFFRACTION-GRATING BASED SEMICONDUCTOR LASER
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United States of America Patent
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Nov 3, 2022
app pub date -
Apr 29, 2022
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Apr 29, 2022
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It is an aim of the present invention to provide ultra-compact highly-integrated diffraction-grating semiconductor lasers on chips. Various embodiments combined enable the lasers to be compact in size, light weight, mechanically rugged, low in manufacturing cost, and in some cases high in electrical wall-plugged power efficiency or high in optical power output, comparing to typical lasers based on discrete optical components.
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