Circuit board and method of manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11744004
APP PUB NO 20220346218A1
SERIAL NO

17464935

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Abstract

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A circuit board includes a first outer wiring layer, a circuit substrate, and a second outer wiring layer stacked. The circuit substrate includes a first inner wiring layer, an insulating layer, and a second inner wiring layer stacked. A plurality of thermally conductive pillars is arranged at intervals on the first inner wiring layer, a liquid storage space is formed between every two adjacent thermally conductive pillars, and a thermally conductive agent is received in the liquid storage space. The first outer wiring layer is formed on the plurality of thermally conductive pillars. The second outer wiring layer is formed the second inner wiring layer. A first groove penetrates the second outer wiring layer, the second inner wiring layer and the insulating layer, exposes a portion of the first inner wiring layer, and corresponds to the thermally conductive pillars. At least one heating element is installed in the first groove.

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Patent Owner(s)

Patent OwnerAddress
AVARY HOLDING (SHENZHEN) CO LIMITED27TH FLOOR BLOCK A AVARY TIME CENTER NO 2038 HAIXIU ROAD HAIBIN COMMUNITY XIN AN STREET SHENZHEN
GARUDA TECHNOLOGY CO LTD4F NO 156 SEC 1 ZHONGSHAN RD BANQIAO DIST NEW TAIPEI CITY 22065 TAIWAN(R O C) NEW TAIPEI
QING DING PRECISION ELECTRONICS (HUAIAN) CO LTD223065 NO 8 PENGDING ROAD HUAI'AN ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE HUAI'AN CITY JIANGSU PROVINCE HUAIAN CITY JIANGSU PROVINCE 223065

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Li, Wei-Xiang Shenzhen, CN 8 8

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