Power conversion device
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United States of America Patent
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Aug 27, 2024
Grant Date -
Oct 27, 2022
app pub date -
Apr 23, 2020
filing date -
Apr 23, 2020
priority date (Note) -
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Abstract
A technology that prevents an encapsulation member encapsulating a semiconductor element from leaking between a resin-made casing and a heat dissipator is provided. A power conversion device includes a heat dissipator that includes a mount surface on which semiconductor elements are mounted, a resin-made casing that includes an intimate-contact surface that intimately contacts the mount surface, and which contains therein the semiconductor elements, and an encapsulation member that encapsulates the semiconductor elements within the casing. A first surrounding portion that surrounds the semiconductor elements is provided on the mount surface of the heat dissipator. A second surrounding portion that surrounds the semiconductor elements is provided on the intimate-contact surface of the casing. The first surrounding portion and the second surrounding portion are fitted with each other in the concavo-convex shape.
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