LED PACKAGE STRUCTURE, LED PACKAGING METHOD, AND LIGHT SOURCE
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United States of America Patent
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Issued Date -
Oct 27, 2022
app pub date -
Jun 11, 2021
filing date -
Jun 11, 2021
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Abstract
An LED package structure, an LED packaging method, and a light source are disclosed. The LED package structure includes a first surface and at least one side face adjacent to the first surface. The LED package structure further includes: a first soldering side disposed on the first surface; and a second soldering side electrically connected to the first soldering side and disposed on the side face.
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