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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
TOP TECHNOLOGY LTD	10 SEOTAN 2-RO SEOTAN-MYEON PYEONGTAEK-SI GYEONGGI-DO 17701
SHERKIN TECHNOLOGIES LIMITED	27 SORREL HEATH CLONSILLA DUBLIN 15

International Classification(s)

• H01J:ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
• B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
• B81C:PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE M....
• B01L:CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENE....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
KIM, Sangbae	Hwaseong-si, KR	7	122
KIM, Yongtae	Yongin-si, KR	54	386
LEE, Youngho	Yongin-si, KR	38	216
O'SULLIVAN, Donal	Dublin, IE	9	29

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
3.5 Year Payment	$1600.00	$800.00	$400.00	Apr 27, 2026
7.5 Year Payment	$3600.00	$1800.00	$900.00	Apr 27, 2030
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Apr 27, 2034

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 3.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2022/0340,416

A PROCESS AND APPARATUS FOR THE PREPARATION OF A BONDED SUBSTRATE

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