MEMS ROTOR WITH COATED BOTTOM SURFACE
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United States of America Patent
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Issued Date -
Oct 27, 2022
app pub date -
Apr 20, 2022
filing date -
Apr 20, 2022
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Abstract
This disclosure describes a comprising a handle wafer and a device wafer which is bonded to the handle wafer. The handle wafer comprises a cavity and the device wafer comprises a mobile rotor part above the cavity. A bottom coating layer covers at least a part of the bottom surface of the rotor.
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