TECHNOLOGIES FOR PACKAGE LOADING MECHANISMS
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United States of America Patent
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Issued Date -
Oct 20, 2022
app pub date -
Jun 27, 2022
filing date -
Jun 27, 2022
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Abstract
Techniques for package loading mechanisms are disclosed. In the illustrative embodiment, a base portion of a laptop includes a circuit board on which an integrated circuit component is mounted. A heat sink is mated with the integrated circuit component. A spring presses against part of the chassis of the laptop, pressing the integrated circuit component and the heat sink together, providing strong thermal coupling between them.
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