Electronic apparatus, non-contact switch, and photoelectric sensor
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United States of America Patent
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Jun 25, 2024
Grant Date -
Oct 20, 2022
app pub date -
Mar 3, 2020
filing date -
Sep 12, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic apparatus includes, in a case, substrates with electronic components mounted thereon, a thermoplastic hot-melt resin, and a fluid branch member, wherein: the inside of the case is divided into a plurality of spaces; the plurality of spaces are at least any space among spaces between the case and the substrates and spaces between the substrates, and are filled with the thermoplastic hot-melt resin; and the fluid branch member is provided with an opening as an inlet for the thermoplastic hot-melt resin, and flow path parts for branching the thermoplastic hot-melt resin into multiple parts and guiding the same.
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