WAFER ADAPTOR FOR ADAPTING DIFFERENT SIZED WAFERS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Oct 20, 2022
app pub date -
Apr 18, 2022
filing date -
Apr 16, 2021
priority date (Note) -
Published
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
A wafer adaptor ring assembly for adapting an adapted sized wafer for plasma dicing by a plasma etch chamber designed for dicing a designed sized wafer, which is larger than the adapted sized wafer is disclosed. The wafer adaptor ring assembly includes a primary wafer ring designed for plasma dicing the designed sized wafer by the plasma, an adhesive sheet attached to a bottom surface of the primary wafer ring, and an adapted sized wafer disposed on the adhesive sheet between the primary wafer ring and the adapted sized wafer. A method for forming the wafer adaptor ring assembly is also disclosed.
First Claim
Other Claims data not available