HEAT-FLOW SENSOR
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United States of America Patent
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Issued Date -
Oct 13, 2022
app pub date -
Sep 25, 2019
filing date -
Sep 25, 2019
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Abstract
A heat-flow sensor that includes an insulating layer, a magnetic field application layer arranged on a first surface of the insulating layer and composed of a conductor, and a heat-flow detection layer arranged on a second surface of the insulating layer, the second surface facing the first surface, and the heat-flow detection layer composed of a conductive magnetic body. The heat-flow detection layer faces the magnetic field application layer via the insulating layer.
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