EPOXY RESIN COMPOSITION AND HEAT DISSIPATION CIRCUIT BOARD USING SAME
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United States of America Patent
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Issued Date -
Oct 13, 2022
app pub date -
Nov 28, 2019
filing date -
Sep 18, 2019
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Abstract
The present disclosure relates to an epoxy resin composition having a thermal conductivity of at least 5 W/m·k, which has a sufficient thermal emission effect when implementing a multilayer circuit and can replace a ceramic substrate used in automobiles, home appliances, electric vehicles and the like, and to a heat dissipation circuit board using the same. The epoxy resin composition according to one embodiment of the present disclosure, the epoxy resin composition includes an epoxy resin, a curing agent and an inorganic filler. The inorganic filler may include alumina having a maximum particle diameter of less than 32 μm and aluminum nitride having a mean particle diameter of 0.5 to 1.0 μm, in an amount of 85 wt % or more. The epoxy resin composition includes an inorganic filler having a mean particle diameter of 1.0 μm to form an insulating layer having excellent thermal conductivity and withstand voltage properties, thereby providing a high heat dissipation circuit board that is superior compared to existing single layer circuit boards.
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