LASER SOLDERING METHOD AND DEVICE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Oct 6, 2022
app pub date -
Sep 26, 2019
filing date -
Sep 26, 2019
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A hot wind is blown to a land and a lead from the underside of a printed board, to perform preheating. At the start of preheating or after start of preheating, a laser beam is applied to a soldering point, and meanwhile, wire solder is fed to a position contacting with the soldering point. The fed wire solder is melted by the laser beam. After soldering is finished, feeding of the wire solder is stopped. Application of the laser beam is stopped, to solidify the melted solder.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully