Semiconductor Structure and Method for Manufacturing Semiconductor Structure
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United States of America
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Jan 13, 2022
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Jan 13, 2022
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The embodiments of the present disclosure belong to the technical field of semiconductor manufacturing, and relate to a semiconductor structure and a method for manufacturing a semiconductor structure. Each of a plurality of storage structures in the semiconductor structure includes a plurality of capacitor structures stacked in a direction perpendicular to a substrate, each of the plurality of capacitor structures includes a bottom plate and an top plate which are arranged opposite to each other, and a first dielectric layer located between the bottom plate and the top plate, and the bottom plate and the top plate are both parallel to the substrate, all bottom plates in each of the plurality of storage structures are electrically connected, and all top plates in each of the plurality of storage structures are electrically connected; the bottom plate and the top plate extend in a plane parallel to the substrate.
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