Partially Staggered Ball Array for Reduced Noise Injection
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United States of America
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Mar 25, 2021
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Mar 25, 2021
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Abstract
A package having reduced injected noise into balls carrying sensitive signals is described. An array of solder balls is mounted on a substrate wherein the solder balls provide package output. Solder balls adjacent to a noise-sensitive solder ball package output are shifted by one-half the pitch of the array of solder balls to equalize mutual parasitic inductance around the noise-sensitive solder ball package output.
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