Method for manufacturing electrochemical device having exposed metal layer outside packaging
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United States of America Patent
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Oct 31, 2023
Grant Date -
Sep 29, 2022
app pub date -
May 10, 2021
filing date -
Mar 25, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed herein is an electrochemical device forming a chip-capacitor or a super-capacitor. The electrochemical device includes: a ceramic substrate having a nonconductive ceramic layer, a current collecting layer disposed on a nonconductive ceramic layer and made of ceramic or cermet, and a metal layer arranged on outer surfaces of the nonconductive ceramic layer and the current collecting layer; an electrode having a positive electrode and a negative electrode and formed on the current collecting layer; and a nonconductive ceramic packaging module located on the ceramic substrate to accommodate electrolyte therein, wherein the metal layer is exposed to the outside of the nonconductive ceramic packaging module.
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