COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS
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United States of America
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app pub date -
Jun 13, 2022
filing date -
Jun 13, 2022
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Abstract
In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
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International Classification(s)
- C23C:COATING METALLIC MATERIAL; COATING MATERIAL WITH M....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- C03C:CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREO....
- B81C:PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE M....
- G06F:ELECTRIC DIGITAL DATA PROCESSING
- H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
- C22F:CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS MET....
- C21D:MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
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