Stretchable 3D-printed circuit boards
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United States of America Patent
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Dec 26, 2023
Grant Date -
Sep 22, 2022
app pub date -
Mar 21, 2022
filing date -
Mar 22, 2021
priority date (Note) -
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Abstract
Disclosed herein are devices comprising stretchable 3D circuits and methods for fabricating the circuits. The fabrication process includes providing in the elastomeric polymer as a substrate and providing conductive interconnects within the substrate encased in an insulating polymer, such as polyimide, to provide a stiffness gradient between the conductive interconnects and the flexible elastomeric substrate. The circuit may be fabricated as a multilayer construction using three-dimensional pillars as vias and as external interconnects to the circuit.
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