METAL COMPONENT
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United States of America Patent
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Issued Date -
Sep 8, 2022
app pub date -
Feb 23, 2022
filing date -
Mar 4, 2021
priority date (Note) -
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Abstract
There is provided a metal component used for manufacturing a semiconductor device, including: a base material having an electrical conductivity; a nickel layer formed on a surface of the base material and containing nickel as a main component; and a noble metal layer formed on a surface of the nickel layer. The nickel layer includes a first nickel layer not containing phosphorus, and a second nickel layer containing 0.01 to 1 in percent by weight of phosphorus. According to the metal component of the present disclosure, a thickness of the nickel layer can be reduced while good characteristics can be maintained.
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