SUBSTRATE CLEANING METHOD, SUBSTRATE CLEANING SYSTEM, AND MEMORY MEDIUM

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United States of America Patent

APP PUB NO 20220277968A1
SERIAL NO

17745998

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Abstract

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A method for cleaning a substrate includes supplying, to a substrate which does not have a resist formed thereon, a film-forming processing liquid which includes a volatile component and forms a processing film, volatilizing the volatile component of the film-forming processing liquid such that the film-forming processing liquid on the substrate is solidified or cured and that the processing film is formed on the substrate, heating a peeling processing liquid which peels off the processing film from the substrate without dissolving the processing film such that a heated peeling processing liquid is prepared, and supplying, to the processing film formed on the substrate, the heated peeling processing liquid such that the heated peeling processing liquid peels off the processing film from the substrate without dissolving the processing film.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 107-6325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AIBARA, Meitoku Koshi City, JP 16 118
KANEKO, Miyako Nirasaki City, JP 23 190
KANNO, Itaru Minato-ku, JP 54 745
ORII, Takehiko Nirasaki City, JP 82 1252
TANAKA, Satoru Koshi City, JP 341 3727
TANOUCHI, Keiji Nirasaki City, JP 19 110

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