CHEMICAL MECHANICAL PLANARIZATION SLURRIES AND PROCESSES FOR PLATINUM GROUP METALS
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United States of America Patent
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Sep 1, 2022
app pub date -
Feb 26, 2021
filing date -
Feb 26, 2021
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Abstract
A method for planarizing a metal conductor layer embedded in a dielectric layer is provided. The method includes removing a portion of an overburden of the metal conductor layer that is formed over the dielectric layer with a first CMP slurry. The method also includes removing a remaining portion of the overburden of the metal conductor layer with a second CMP slurry to expose upper portions of the dielectric layer.
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