Importance

Loading Importance Indicators...

Abstract

Various techniques are provided for protecting an infrared imager of a wafer level package. In one example, a method includes maintaining a protective member in a first position blocking an aperture of a wafer level package of an imaging system to protect an infrared imager disposed within the wafer level package. The method also includes attaching an optical assembly to the imaging system. The method also includes translating the protective member from the first position to a second position in response to a first force applied by the optical assembly against the imaging system during the attaching. The protective member is displaced from the aperture in the second position to expose the aperture to the optical assembly. Additional methods and systems are also provided.

Loading the Abstract Image...

First Claim