Importance

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Abstract

A method for assembling at least one stacked substrate package, each stacked substrate package includes binding a laminated base substrate, configured to route interconnections between circuitry on a first surface of the laminated base substrate and circuitry on a second surface of the laminated base substrate, to a surface of a rigid carrier to prevent warping of the laminated base substrate. Each base substrate is coupled to at least one dielectric build-up substrate, which is configured to route integrated interconnections between a top surface and a bottom surface of the dielectric build-up substrate, to the laminated base substrate. At least one integrated circuit die is coupled to the at least one dielectric build-up substrate, and then the carrier is released from the laminated base substrate to form an assembled stacked substrate package. Also, multiple stacked substrate packages may be assembled in parallel on one carrier.

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First Claim