MODIFICATION OF STRESS RESPONSE AND ADHESION BEHAVIOR OF DIELECTRIC THROUGH TUNING OF MECHANICAL PROPERTIES
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United States of America Patent
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Aug 18, 2022
app pub date -
Jun 24, 2020
filing date -
Jun 24, 2019
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Abstract
The disclosed subject matter relates to a dielectric stack that includes a dielectric layer formed from a dielectric material that includes one or more constituent components each having a Tg value of 70° C. or lower and that is annealed at a temperature exceeding the highest Tg value of the one or more constituent components.
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