Three-dimensional hierarchical layered porous copper and method for making the same

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United States of America Patent

PATENT NO 11660839
APP PUB NO 20220250352A1
SERIAL NO

17344115

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A method for making a three-dimensional hierarchical layered porous copper, the method includes providing a copper-zinc alloy precursor being composed of a β′ phase and a γ phase, and treating the copper-zinc alloy precursor by electrochemical dealloying. The present application further provides a three-dimensional hierarchical layered porous copper including a first surface layer, an intermediate layer, and a second surface layer stacked in that order. The first surface layer includes a plurality of micron-scale pores and a plurality of first nanoscale pores. The intermediate layer includes a plurality of second nanoscale pores. The second surface layer includes the plurality of micron-scale pores and the plurality of first nanoscale pores.

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Patent Owner(s)

Patent OwnerAddress
HON HAI PRECISION INDUSTRY CO LTDNO 66 JHONGSHAN RD TUCHENG DIST NEW TAIPEI CITY 236038
TSINGHUA UNIVERSITY100084 TSINGHUA YUAN BEIJING HAIDIAN DISTRICT BEIJING CITY BEIJING CITY 100084

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Lu Beijing, CN 195 885
Li, Bin Beijing, CN 1200 10531
Li, Wen-Zhen Beijing, CN 34 128
Luan, Chen Beijing, CN 1 0
Zhu, Lin Beijing, CN 183 1022

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