THERMAL CONDUCTIVE FILM

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20220246491A1
SERIAL NO

17726916

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An adhesive film includes a porous metal layer having a plurality of pores therein, a first adhesive layer on one side of the porous metal layer, an adhesive substance at least partially filling the pores of the porous metal layer, and a plurality of first thermal conductive members distributed in the first adhesive layer.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDSUWON-SI GYEONGGI-DO 16677

International Classification(s)

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  • 2022 Application Filing Year
  • C09J Class
  • 1059 Applications Filed
  • 188 Patents Issued To-Date
  • 17.76 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHOI, Yongwon Hwaseong-si, KR 30 49
KANG, Myung-Sung Yongin-si, KR 11 119
KIM, Yeongseok Hwaseong-si, KR 19 41
LEE, Joungphil Suwon-si, KR 7 12
SEO, Gwangsun Jeonju-si, KR 2 6
YOO, Hyein Suwon-si, KR 9 53

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Patent Citation Ranking

  • 1 Citation Count
  • C09J Class
  • 86.09 % this patent is cited more than
  • 3 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges2293701 - 100102030405060708090100110120130140150160170180190200210220230240250

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