CHASSIS STRUCTURES AND INTERCONNECTIONS FOR LIGHTER-THAN-AIR PLATFORMS

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20220242566A1
SERIAL NO

17165995

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Aspects of the technology relate to lighter-than-air (LTA) high altitude platforms configured to operate in the stratosphere. Such platforms can generate operate for weeks, months or longer. Shaped envelope LTA platforms may support a payload that provides telecommunications and/or other services to remote regions around the world. The payload may be arranged with other components on a modular bus-type chassis. One or more components may be moveable along the chassis to change the pitch of the vehicle for more effective flight operation. The modular chassis may include a truss configuration assembled from one or more subunits. The subunits may be preassembled with different equipment packages. Trusses formed using sets of struts may have two or more struts terminating at one interconnection node. Node connection elements, such as compound dovetail interconnects, facilitate a reliable, repeatable and quick mounting method for structural interconnections, which can lead to faster assembly and disassembly times.

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Patent Owner(s)

Patent OwnerAddress
LOON LLC1600 AMPHITHEATRE PARKWAY MOUNTAIN VIEW CA 94043

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hijmans, Carey Morgan Hill, US 8 7
Phillips, Woodruff Redwood City, US 2 10

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