JUNCTION STRUCTURE, METHOD FOR MANUFACTURING JUNCTION STRUCTURE, AND SOLDER BALL

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United States of America Patent

APP PUB NO 20220241903A1
SERIAL NO

17605844

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a joint structure. The joint structure includes a first structure, and a second structure joined to the first structure via a joint portion formed of a Au—Sn-based alloy, wherein a thickness of the joint portion is 3 μm or more and 50 μm or less.

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Patent Owner(s)

Patent OwnerAddress
NIPPON MICROMETAL CORPORATIONSAITAMA
NIPPON STEEL CHEMICAL & MATERIAL CO LTD13-1 NIHONBASHI 1-CHOME CHUO-KU TOKYO 1030027 ?1030027

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AKASHI, Keisuke Saitama, JP 3 4
HOSHINO, Katsuhiko Saitama, JP 1 0
KOBAYASHI, Takayuki Tokyo, JP 235 2198
KOMORI, Kiyotsugu Saitama, JP 1 0
MISAWA, Kensuke Tokyo, JP 2 0
TANAKA, Masamoto Tokyo, JP 18 134
YAMAMOTO, Sukeyoshi Tokyo, JP 16 40
YAMAZAKI, Tsunekazu Saitama, JP 1 0

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