FLEXIBLE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME, AND DISPLAY MODULE THEREOF
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United States of America Patent
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Issued Date -
Jul 28, 2022
app pub date -
Feb 7, 2021
filing date -
Feb 20, 2020
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Abstract
A flexible circuit board comprises: a flexible substrate, a lead layer, a first insulating layer and a pin layer. The lead layer comprises a plurality of leads provided at one side of the flexible substrate; the first insulating layer is provided at a side of the lead layer facing away from the flexible substrate, the first insulating layer is provided with a plurality of via holes, and the orthographic projection of each via hole on the flexible substrate at least partially overlaps with the orthographic projection of the corresponding lead on the flexible substrate; the pin layer comprises a plurality of pins provided at a side of the first insulating layer facing away from the flexible substrate, the plurality of pins are provided in one-to-one correspondence with the plurality of leads, and the pins are respectively connected to the corresponding leads through the via holes.
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