Package substrate inductor having thermal interconnect structures
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United States of America Patent
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Jun 27, 2023
Grant Date -
Jul 28, 2022
app pub date -
Apr 13, 2022
filing date -
Jul 5, 2018
priority date (Note) -
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Abstract
Embodiments include a microelectronic device package structure having an inductor within a portion of a substrate, wherein a surface of the inductor is substantially coplanar with a surface of the substrate. One or more thermal interconnect structures are on the surface of the inductor. A conductive feature is embedded within a board, where a surface of the conductive feature is substantially coplanar with a surface of the board. One or more thermal interconnect structures are on the surface of the conductive feature of the board, where the thermal interconnect structures provide a thermal pathway for cooling for the inductor.
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