High Adhesion Resistive Composition
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United States of America Patent
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Issued Date -
Jul 28, 2022
app pub date -
May 26, 2020
filing date -
Jun 10, 2019
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Abstract
A resistive composition is provided to form thick film resistors on a substrate. The resistive composition includes platinum particles and ceramic particles. The ceramic particles include alumina particles. An organic vehicle can be included to form an ink or paste for thick film process. After application to the substrate, the resistive composition is fired to form the thick film resistors, which is fully adhered to the substrate.
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