Method for detecting coverage rate of intermetallic compound

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United States of America Patent

PATENT NO 12031920
APP PUB NO 20220236195A1
SERIAL NO

17614905

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Abstract

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Disclosed is a method for detecting coverage rate of an intermetallic compound, the method comprising putting a chip subjected to wire bonding into a mixed reagent of fuming nitric acid and fuming sulfuric acid for soaking, wherein the chip subjected to wire bonding comprises a silver wire and an aluminum; taking out the chip after the silver wire is removed; and detecting the coverage rate of an intermetallic compound on the aluminum pad.

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Patent Owner(s)

Patent OwnerAddress
WEIFANG GOERTEK MICROELECTRONICS CO LTDWEIFANG SHANDONG 261031

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Song, Qinglin Shandong, CN 20 72
Tian, Dewen Shandong, CN 8 5
Zhong, Dingguo Shandong, CN 1 0

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