Circuit board structure and spliced circuit board

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11477886
APP PUB NO 20220232702A1
SERIAL NO

17367419

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A circuit board structure includes a body, multiple first pads, a conductive assembly, multiple first engaging components, and multiple second engaging components. The body includes a first portion and a second portion integrally formed. A first surface of the first portion directly contacts a second surface of the second portion. A first region of the first surface protrudes from the second portion, and a second region of the second surface protrudes from the first portion. The first pads and the first engaging components are disposed on the first portion of the body and located in the first region of the first surface. The conductive assembly and the second engaging components are disposed on the second portion of the body and located in the second region of the second portion. The first pads are located between the first engaging components, and the conductive assembly is located between the second engaging components.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
UNIMICRON TECHNOLOGY CORPNO 179 SHANYING RD GUISHAN DIST TAOYUAN CITY 333422

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsieh, Ching-Ho Taoyuan, TW 18 56
Tsai, Wang-Hsiang Taoyuan, TW 7 61
Yu, Yunn-Tzu Taoyuan, TW 1 0

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