SOLDERING IRON INCLUDING TEMPERATURE PROFILING AND METHOD OF USE
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United States of America Patent
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N/A
Issued Date -
Jul 21, 2022
app pub date -
May 17, 2021
filing date -
Jan 15, 2021
priority date (Note) -
Published
status (Latency Note)
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Abstract
A soldering iron with temperature profiling, comprising a hand piece or a robot arm including a soldering tip; a processor configured to provide temperature profiling where the soldering tip is one or more of the following during a soldering event: provided at a fixed tip temperature ramp rate during the soldering event; and provided at an adjustable tip temperature ramp rate during the soldering event.
First Claim
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