SEMICONDUCTOR STRUCTURE HAVING COMPOSITE MOLD LAYER
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United States of America Patent
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Issued Date -
Jul 14, 2022
app pub date -
Sep 8, 2021
filing date -
Jan 11, 2021
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Abstract
A semiconductor structure of the inventive concepts includes a chip region comprising a plurality of semiconductor chips on the substrate; and a peripheral region at a periphery of the chip region, the peripheral region including a mold structure. The mold structure may include a base mold layer on the substrate, and a composite mold layer on the base mold layer, the composite mold layer comprising at least one bowing sacrificial layer and at least one bowing prevention layer.
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