METHOD OF CONNECTION TO A CONDUCTIVE MATERIAL
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United States of America Patent
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Issued Date -
Jul 14, 2022
app pub date -
Jan 12, 2022
filing date -
Jan 13, 2021
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Abstract
A method of connection to a conductive material for, such as, a switchable film, includes steps of providing a switchable film having a first substrate, a first conductive layer, a switchable layer, a second conductive layer, and a second substrate; applying a solder material to the first conductive layer with ultrasonic application to provide a first busbar; and applying the solder material to the second conductive layer with ultrasonic application to provide a second busbar. The busbars are to be connected to connectors.
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