Lighting-emitting Diode Chip and Manufacturing Method, Display Device
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United States of America Patent
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Issued Date -
Jul 7, 2022
app pub date -
Mar 25, 2022
filing date -
Nov 25, 2020
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Abstract
The disclosure relates to a light-emitting diode chip and a manufacturing method thereof, and a display device. The light emitting diode chip includes a transparent substrate, an epitaxial layer, a first electrode and a second electrode. The epitaxial layer includes a first semiconductor layer, a second semiconductor layer, and a light-emitting layer. A containing groove is formed in the first semiconductor layer, and a metal layer is arranged in the containing groove. The metal layer is in ohmic contact with the first semiconductor layer. The second semiconductor layer is provided with an inclined groove, and the transparent substrate is combined with the first semiconductor layer. The first electrode is arranged in the inclined groove, and the second electrode is arranged on the second semiconductor layer.
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