SEMICONDUCTOR PROCESS POLISHING COMPOSITION AND POLISHING METHOD OF SUBSTRATE APPLIED WITH POLISHING COMPOSITION
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United States of America
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Jun 30, 2022
app pub date -
Dec 28, 2021
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Dec 28, 2021
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Abstract
A semiconductor process polishing composition, and a polishing method of a substrate applied with a polishing composition are provided. The process provides a polishing composition improved in the polishing rate, selectivity and dispersibility, and provides a manufacturing method of a substrate that is polished by applying such a polishing composition for a semiconductor process.
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